In scaling quantum computers to millions of qubits, the large mass of metallic connecting cables would create unacceptable heat loads on cryogenic cooling systems. Instead, a highly efficient wireless interconnect approach — using complementary metal–oxide–semiconductor (CMOS) terahertz transceivers with backscatter communication schemes — could provide a high-capacity, low-heat interconnect solution for future cryogenic electronic hardware.
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Fig. 1: Architecture of a wireless contactless link, to replace metallic cables in a cryogenic quantum computing system.
References
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This is a summary of: Wang, J. et al. A wireless terahertz cryogenic interconnect that minimizes heat-to-information transfer. Nat. Electron. https://doi.org/10.1038/s41928-025-01355-9 (2025).
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Terahertz wireless interconnects for cryogenic electronics. Nat Electron (2025). https://doi.org/10.1038/s41928-025-01356-8
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Published:01 April 2025
DOI:https://doi.org/10.1038/s41928-025-01356-8
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